US 12,390,880 B2
Method for operating an ultrasonic connecting device
Andreas Jochheim, Paderborn (DE); Matthias Hunstig, Paderborn (DE); and Michael Broekelmann, Delbrueck (DE)
Assigned to Hesse GmbH, Paderborn (DE)
Filed by HESSE GmbH, Paderborn (DE)
Filed on Jul. 25, 2023, as Appl. No. 18/226,046.
Application 18/226,046 is a continuation of application No. PCT/DE2021/101019, filed on Dec. 20, 2021.
Claims priority of application No. 10 2021 101 654.1 (DE), filed on Jan. 26, 2021.
Prior Publication US 2023/0364703 A1, Nov. 16, 2023
Int. Cl. B23K 20/00 (2006.01); B23K 20/10 (2006.01); B23K 101/38 (2006.01)
CPC B23K 20/10 (2013.01) [B23K 2101/38 (2018.08)] 15 Claims
OG exemplary drawing
 
1. A method for operating an ultrasonic bonding apparatus, the ultrasonic bonding apparatus comprising an ultrasound head that is displaceable in a z direction, the ultrasound head having a carrier, an ultrasound generating device held on the carrier and movable relative thereto, and an ultrasonic tool fixed to the ultrasound generating device to be excited to ultrasonic vibrations by the ultrasound generating device, the method comprising:
positioning an electrically conductive connection conductor above an electrically conductive bonding region provided on a bonding component such that a gap having a determined clearance in the z direction is formed between the connection conductor and a connecting surface of the bonding region facing the connection conductor;
positioning the ultrasound head relative to the connection conductor and the bonding component such that a contact surface of the ultrasonic tool, designed for contact with the connection conductor, faces the connection conductor;
applying a bonding force, active in the z direction, to the ultrasound generating device to press the ultrasound generating device against the carrier;
and subsequently lowering the ultrasound head in the z direction, and determining a displacement position of the ultrasound head in the z direction as well as a relative position of the ultrasound generating device with respect to the carrier in the z direction; and
taking into account the displacement position and the relative position, a contact point in time is determined at which the connection conductor is lowered so far by the ultrasonic tool so as to touch the bonding region of the bonding component.