US 12,390,879 B2
Dual type ultrasonic bonding apparatus and bonding method using the same
Du Hyun Song, Suwon-si (KR); and Chun Su Yoon, Suwon-si (KR)
Assigned to WITS CO., LTD., Gyeonggi-Do (KR)
Filed by WITS Co., Ltd., Yongin-si (KR)
Filed on Mar. 17, 2023, as Appl. No. 18/185,604.
Claims priority of application No. 10-2022-0135951 (KR), filed on Oct. 20, 2022; and application No. 10-2022-0180588 (KR), filed on Dec. 21, 2022.
Prior Publication US 2024/0131613 A1, Apr. 25, 2024
Prior Publication US 2024/0227060 A9, Jul. 11, 2024
Int. Cl. B23K 20/10 (2006.01); B23K 20/26 (2006.01)
CPC B23K 20/10 (2013.01) [B23K 20/26 (2013.01)] 3 Claims
OG exemplary drawing
 
1. A dual heating type ultrasonic bonding apparatus comprising:
a stage;
a part seating jig on the stage; and
an ultrasonic bonding unit disposed to correspond to the part seating jig and configured to bond dissimilar parts seated on the part seating jig,
wherein the stage includes a first heater configured to transfer heat to the dissimilar parts through the part seating jig,
wherein an upper portion of the stage includes a first recess, in which the part seating jig is to be seated,
wherein the first heater is at a lower portion of the first recess,
wherein the part seating jig includes a protrusion at a lower portion thereof, the protrusion configured to be coupled to the first recess,
wherein an upper portion of the part seating jig includes a second recess, in which the dissimilar parts are to be seated, and
wherein the ultrasonic bonding unit includes
an ultrasonic horn configured to apply ultrasonic waves to the dissimilar parts, and
a second heater coupled to the ultrasonic horn, and configured to transfer heat to the dissimilar parts through the ultrasonic horn.