US 12,390,326 B2
Implant with fillable reservoir
Skander Limem, Lynnfield, MA (US); Fabio Felix, Foxborough, MA (US); Said Rizk, Windham, NH (US); David P. Martin, Arlington, MA (US); and Simon F. Williams, Cambridge, MA (US)
Assigned to Tepha, Inc., Lexington, MA (US)
Filed by Tepha, Inc., Lexington, MA (US)
Filed on Dec. 13, 2023, as Appl. No. 18/538,903.
Application 18/538,903 is a division of application No. 17/679,995, filed on Feb. 24, 2022, granted, now 11,883,279.
Application 17/679,995 is a continuation of application No. 16/195,144, filed on Nov. 19, 2018, granted, now 11,291,539.
Claims priority of provisional application 62/587,859, filed on Nov. 17, 2017.
Prior Publication US 2024/0130854 A1, Apr. 25, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. A61F 2/18 (2006.01); A61F 2/00 (2006.01); A61L 27/54 (2006.01); A61L 27/58 (2006.01); A61F 2/12 (2006.01)
CPC A61F 2/186 (2013.01) [A61F 2/0059 (2013.01); A61L 27/54 (2013.01); A61L 27/58 (2013.01); A61F 2/12 (2013.01); A61F 2002/183 (2013.01); A61F 2210/0061 (2013.01); A61F 2250/0003 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of forming an implant with a fillable reservoir, the implant configured to allow tissue ingrowth, the method comprising acts of:
(a) forming a fillable reservoir comprising one or more microporous outer layers and a macroporous structure of fibers located within the fillable reservoir formed by the one or more microporous outer layers, the fillable reservoir formed by:
(i) forming an interconnected network of unit cells by thermal point bonding the one or more microporous outer layers and the macroporous structure, or
(ii) sealing edges of the one or more microporous outer layers with the macroporous structure located within the fillable reservoir.