US D1,088,067 S
3D printer cartridge assembly packaging
Hossein Bassir, Los Angeles, CA (US); and Lee Hendrickson, Los Angeles, CA (US)
Assigned to SprintRay, Inc., Los Angeles, CA (US)
Filed by SprintRay Inc., Los Angeles, CA (US)
Filed on Mar. 28, 2024, as Appl. No. 29/935,006.
Application 29/935,006 is a division of application No. 29/928,224, filed on Feb. 8, 2024, granted, now D1029894.
Application 29/928,224 is a continuation in part of application No. 18/543,791, filed on Dec. 18, 2023.
Application 18/543,791 is a continuation in part of application No. 18/198,257, filed on May 16, 2023, granted, now 12,128,624.
Term of patent 15 Years
LOC (15) Cl. 09 - 03
U.S. Cl. D 9—759  [D15/138; D18/56]
OG exemplary drawing
 
The ornamental design for a 3D printer cartridge assembly packaging, as shown and described.