US 12,389,699 B2
Solid-state imaging device and electronic apparatus
Itaru Oshiyama, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Filed on Oct. 26, 2022, as Appl. No. 18/049,706.
Application 18/049,706 is a continuation of application No. 16/959,709, granted, now 11,508,768, previously published as PCT/JP2018/048418, filed on Dec. 28, 2018.
Claims priority of application No. 2018-002367 (JP), filed on Jan. 11, 2018.
Prior Publication US 2023/0143614 A1, May 11, 2023
Int. Cl. H10F 39/00 (2025.01); H10F 30/20 (2025.01)
CPC H10F 39/8053 (2025.01) [H10F 30/20 (2025.01); H10F 39/811 (2025.01)] 9 Claims
OG exemplary drawing
 
1. A light detecting device, comprising:
a substrate, wherein the substrate includes:
a light receiving surface side configured to receive incident light; and
a back surface side opposite to the light receiving surface;
a wiring layer on the back surface side of the substrate;
a first photoelectric conversion region in the substrate;
a second photoelectric conversion region in the substrate, wherein the second photoelectric conversion region is adjacent to the first photoelectric conversion region in a cross-sectional view;
a trench between the first photoelectric conversion region and the second photoelectric conversion region, wherein the trench penetrates through the substrate to reach the wiring layer on the back surface side of the substrate;
a material disposed in the trench;
a first concave portion region that has a plurality of first concave portions on the light receiving surface side of the substrate, wherein the first concave portion region is above the first photoelectric conversion region;
a second concave portion region that has a plurality of second concave portions on the light receiving surface side of the substrate, wherein the second concave portion region is above the second photoelectric conversion region; and
a film including hafnium on the first concave portion region, the second concave portion region, and the material, wherein the film is undisposed in the trench.