US 12,389,639 B2
Semiconductor device and method of manufacturing semiconductor device
Yusuke Kobayashi, Nagareyama (JP); Yasuhiko Oonishi, Matsumoto (JP); and Masanobu Iwaya, Matsumoto (JP)
Assigned to FUJI ELECTRIC CO., LTD., Kawasaki (JP)
Filed by FUJI ELECTRIC CO., LTD., Kawasaki (JP)
Filed on Nov. 3, 2023, as Appl. No. 18/501,489.
Application 17/038,838 is a division of application No. 15/660,302, filed on Jul. 26, 2017, granted, now 10,840,326, issued on Nov. 17, 2020.
Application 18/501,489 is a continuation of application No. 17/038,838, filed on Sep. 30, 2020, granted, now 11,855,134.
Claims priority of application No. 2016-155088 (JP), filed on Aug. 5, 2016.
Prior Publication US 2024/0063258 A1, Feb. 22, 2024
Int. Cl. H01L 29/06 (2006.01); H01L 29/08 (2006.01); H01L 29/10 (2006.01); H01L 29/16 (2006.01); H01L 29/78 (2006.01); H10D 30/66 (2025.01); H10D 62/10 (2025.01); H10D 62/13 (2025.01); H10D 62/17 (2025.01); H10D 62/832 (2025.01)
CPC H10D 62/107 (2025.01) [H10D 30/665 (2025.01); H10D 30/668 (2025.01); H10D 62/105 (2025.01); H10D 62/157 (2025.01); H10D 62/393 (2025.01); H10D 62/8325 (2025.01); H10D 62/106 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising
a silicon carbide semiconductor body that includes a drift region of a first conductivity type, and in which an active region and an edge termination structure region outside the active region are provided, wherein
the edge termination structure region includes:
a first semiconductor region of a second conductivity type, provided between the drift region and a first main surface of the silicon carbide semiconductor body, the first semiconductor region being provided outside the active region and separated from the first main surface;
a plurality of second semiconductor regions of the second conductivity type, each of which is provided between the first main surface and the first semiconductor region; and
a plurality of third semiconductor regions of the first conductivity type, each of which separates adjacent two of the second semiconductor regions from each other in a lateral direction, and
a bottom surface of each of the second semiconductor regions is in contact with a top surface of the first semiconductor region so that an impurity concentration in the first semiconductor region, in a direction parallel to the first main surface of the silicon carbide semiconductor body, is substantially uniform.