US 12,389,622 B2
High electron mobility transistor devices having a silicided polysilicon layer
Vibhor Jain, Clifton Park, NY (US); Johnatan Avraham Kantarovsky, South Burlington, VT (US); Mark David Levy, Williston, VT (US); Ephrem Gebreselasie, South Burlington, VT (US); Yves Ngu, Birchwood Drive Hinesburg, VT (US); and Siva P. Adusumilli, South Burlington, VT (US)
Assigned to GlobalFoundaries Singapore Pte. Ltd., Singapore (SG)
Filed by GlobalFoundries U.S. Inc., Malta, NY (US)
Filed on Oct. 15, 2023, as Appl. No. 18/487,115.
Application 18/487,115 is a division of application No. 17/503,345, filed on Oct. 17, 2021, granted, now 11,923,446.
Prior Publication US 2024/0038882 A1, Feb. 1, 2024
Int. Cl. H10D 30/47 (2025.01); H10D 30/01 (2025.01); H10D 64/00 (2025.01); H10D 64/60 (2025.01); H10D 64/66 (2025.01)
CPC H10D 30/472 (2025.01) [H10D 30/015 (2025.01); H10D 64/117 (2025.01); H10D 64/605 (2025.01); H10D 64/661 (2025.01); H10D 64/671 (2025.01)] 19 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
an active region above a substrate, the active region comprising at least two material layers with different band gaps, wherein the active region comprises a channel layer and a barrier layer disposed on the channel layer;
source and drain electrodes in contact with the active region;
a gate above the active region, the gate is laterally between the source and drain electrodes, the gate has an upper surface;
a polysilicon layer above the substrate, the polysilicon layer has a lower surface, wherein the polysilicon layer is positioned laterally adjacent to the gate and the lower surface of the polysilicon layer is substantially coplanar with the upper surface of the gate; and
a silicide layer on the polysilicon layer.