US 12,389,569 B2
Injectable heat sink
Nicholas Brian Hansen, Fayetteville, GA (US)
Assigned to Panasonic Automotive Systems Company of America, Division of Panasonic Corporation of North America, Peachtree City, GA (US)
Filed by Panasonic Automotive Systems Company of America, Division of Panasonic Corporation of North America, Peachtree City, GA (US)
Filed on Sep. 29, 2021, as Appl. No. 17/489,080.
Claims priority of provisional application 63/084,805, filed on Sep. 29, 2020.
Prior Publication US 2022/0104389 A1, Mar. 31, 2022
Int. Cl. H05K 7/20 (2006.01); C08J 9/12 (2006.01); C09K 5/14 (2006.01); F28D 21/00 (2006.01); F28F 13/00 (2006.01); F28F 21/02 (2006.01); F28F 21/06 (2006.01)
CPC H05K 7/2039 (2013.01) [C08J 9/122 (2013.01); C09K 5/14 (2013.01); F28D 21/00 (2013.01); C08J 2201/022 (2013.01); C08J 2203/06 (2013.01); C08J 2363/00 (2013.01); F28F 2013/001 (2013.01); F28F 21/02 (2013.01); F28F 21/06 (2013.01); F28F 2255/143 (2013.01)] 20 Claims
OG exemplary drawing
 
18. A heat sink arrangement, comprising:
an electronic assembly including:
an electronic component that produces heat during operation; and
a housing containing the electronic component, the housing having a cavity; and
an electrical contact fitting connected to the housing; and
a nozzle configured to blow a mixture of a two-part epoxy and a blowing agent into the cavity of the housing through the electrical contact fitting to thereby form a foam heat sink in the cavity for drawing heat out of the electronic component.