US 12,389,538 B2
Varying diameters of power-vias in a PCB based on via location
Brian Mark Hostetler, Chippewa Falls, WI (US)
Assigned to Hewlett Packard Enterprise Development LP, Spring, TX (US)
Filed by HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP, Spring, TX (US)
Filed on Jan. 26, 2023, as Appl. No. 18/159,930.
Prior Publication US 2024/0260188 A1, Aug. 1, 2024
Int. Cl. H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/40 (2006.01)
CPC H05K 1/115 (2013.01) [H05K 1/0218 (2013.01); H05K 3/4038 (2013.01); H05K 2201/093 (2013.01); H05K 2201/09636 (2013.01); H05K 2201/10818 (2013.01); H05K 2201/10984 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a printed circuit board (PCB) comprising a power plane and a plurality of power vias electrically connected to the power plane;
a power source mounted to the PCB and electrically connected to the power plane; and
an electronic component mounted to the PCB and electrically connected to the plurality of power vias through a plurality of interconnects;
wherein respective diameters of the plurality of power vias vary based on location;
wherein the respective diameters of the plurality of power vias vary based on distances of the power vias from a reference point;
wherein the electronic component comprises contact pads arranged in a pattern and electrically connected to the plurality of power vias by solder balls;
wherein the reference point corresponds to a center of the pattern of the contact pads; and
wherein the respective diameters of the plurality of power vias decrease as distances of the power vias from the center increase.