US 12,389,524 B2
Molded circuit board and camera module, and manufacturing method thereof and electronic device
Zhongyu Luan, Zhejiang (CN); Zhen Huang, Zhejiang (CN); Bin Lu, Zhejiang (CN); Li Liu, Zhejiang (CN); Chengchang Zheng, Zhejiang (CN); and Tinghua Li, Zhejiang (CN)
Assigned to NINGBO SUNNY OPOTECH CO., LTD., Zhejiang (CN)
Appl. No. 17/631,565
Filed by NINGBO SUNNY OPOTECH CO., LTD., Zhejiang (CN)
PCT Filed Jul. 1, 2020, PCT No. PCT/CN2020/099767
§ 371(c)(1), (2) Date Jan. 31, 2022,
PCT Pub. No. WO2021/017743, PCT Pub. Date Feb. 4, 2021.
Claims priority of application No. 201910698550.8 (CN), filed on Jul. 31, 2019; and application No. 201921220096.7 (CN), filed on Jul. 31, 2019.
Prior Publication US 2022/0279094 A1, Sep. 1, 2022
Int. Cl. H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/06 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01)
CPC H05K 1/0209 (2013.01) [H05K 1/181 (2013.01); H05K 3/06 (2013.01); H05K 3/28 (2013.01); H05K 3/341 (2013.01); H05K 1/0298 (2013.01); H05K 2201/10151 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A molded circuit board, characterized in that it comprises:
a circuit board main body, wherein the circuit board main body includes at least one circuit layer and at least one substrate layer, wherein the circuit layer and the substrate layer are stacked at intervals, and adjacent circuit layers or adjacent substrate layers are not in contact with each other; and
a molded structure, wherein the molded structure includes a molded layer, wherein the molded layer is stacked on at least one surface of the circuit board main body to cover at least a part of the substrate layer of the circuit board main body, and a material of the molded layer is different from that of the substrate layer:
wherein a front molded layer of the molded structure is provided with a groove corresponding to a set of pads of a front circuit layer of the circuit board main body to ensure the pads of the front circuit layer expose to the outside.