US 12,388,921 B2
Electronic device housing with protrusions and electronic device including the same
Hangyu Hwang, Gyeonggi-do (KR); Changsu Kim, Gyeonggi-do (KR); Sangsik Na, Gyeonggi-do (KR); Yeonghwan Gong, Gyeonggi-do (KR); Hyunjung Jung, Gyeonggi-do (KR); Sungho Cho, Gyeonggi-do (KR); Junpil Kim, Gyeonggi-do (KR); Jinho Kim, Gyeonggi-do (KR); Jinshik Lim, Gyeonggi-do (KR); and Jungho Hwang, Gyeonggi-do (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed on Jul. 14, 2022, as Appl. No. 17/864,979.
Application 17/864,979 is a continuation of application No. PCT/KR2022/007925, filed on Jun. 3, 2022.
Claims priority of application No. 10-2021-0102091 (KR), filed on Aug. 3, 2021.
Prior Publication US 2023/0038052 A1, Feb. 9, 2023
Int. Cl. H04M 1/02 (2006.01); G06F 1/16 (2006.01); H05K 5/00 (2025.01); H05K 5/02 (2006.01); H05K 5/03 (2006.01)
CPC H04M 1/0283 (2013.01) 18 Claims
OG exemplary drawing
 
1. An electronic device housing comprising:
a substrate including:
a front surface comprising a plurality of front surface protrusions and a plurality of taper protrusions protruding from the plurality of front surface protrusions and
a rear surface comprising a plurality of rear surface protrusions; and
wherein two protrusions selected from the plurality of front surface protrusions, the plurality of taper protrusions, and the plurality of rear surface protrusions are different from each remaining ones of the plurality of front surface protrusions, the plurality of taper protrusions, and the plurality of rear surface protrusions;
a deposition layer formed on the front surface of the substrate; and
a transparent coating layer formed on the rear surface of the substrate,
a print layer formed between the transparent coating layer and the rear surface and partially or completely covering the rear surface,
wherein tips of the plurality of taper protrusion comprise round shape.