US 12,388,064 B2
Optical sensor package structure and electronic device
Kui Wang, Qingdao (CN); Dexin Wang, Qingdao (CN); Yanmei Sun, Qingdao (CN); and Haiqiang Song, Qingdao (CN)
Assigned to QINGDAO GOERTEK INTELLIGENT SENSOR CO., LTD, Qingdao (CN)
Appl. No. 17/999,954
Filed by QINGDAO GOERTEK INTELLIGENT SENSOR CO., LTD, Qingdao (CN)
PCT Filed Dec. 10, 2020, PCT No. PCT/CN2020/135395
§ 371(c)(1), (2) Date Nov. 28, 2022,
PCT Pub. No. WO2021/238150, PCT Pub. Date Dec. 2, 2021.
Claims priority of application No. 202010472882.7 (CN), filed on May 29, 2020.
Prior Publication US 2023/0246012 A1, Aug. 3, 2023
Int. Cl. H01L 25/16 (2023.01); H01L 23/00 (2006.01); A61B 5/1455 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01)
CPC H01L 25/167 (2013.01) [H01L 24/16 (2013.01); A61B 5/1455 (2013.01); H01L 23/3121 (2013.01); H01L 23/481 (2013.01); H01L 24/17 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/17181 (2013.01); H01L 2924/12043 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An optical sensor package structure, comprising:
a substrate;
a signal processing chip provided on a surface of the substrate, wherein the signal processing chip is provided with a conductive through hole, and the signal processing chip is electrically connected to the substrate via the conductive through hole;
a photodiode provided on a surface of the signal processing chip away from the substrate, wherein the photodiode is electrically connected to the substrate via the conductive through hole; and
a potting adhesive layer, wherein the potting adhesive layer is for wrapping the signal processing chip and the photodiode, and an elongation at break of the potting adhesive layer is greater than 40%,
wherein:
a surface of the substrate facing the signal processing chip is provided with a first pad,
a surface of the signal processing chip facing the substrate is provided with a redistribution layer,
the signal processing chip is electrically connected to the first pad via the conductive through hole and the redistribution layer,
the surface of the signal processing chip facing the substrate is provided with a solder ball, and the solder ball is electrically connected to the redistribution layer, and
the first pad is provided with a solder joint, and the solder ball is electrically abutted against the solder joint.