US 12,388,048 B2
Semiconductor package comprising heat spreader
Sungeun Jo, Hwaseong-si (KR); Youngdeuk Kim, Hwaseong-si (KR); Jaechoon Kim, Incheon (KR); Taehwan Kim, Hwaseong-si (KR); and Kyungsuk Oh, Seongnam-si (KR)
Assigned to Samsung Electronics Co., Ltd., (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Jun. 20, 2022, as Appl. No. 17/844,395.
Claims priority of application No. 10-2021-0113984 (KR), filed on Aug. 27, 2021.
Prior Publication US 2023/0063886 A1, Mar. 2, 2023
Int. Cl. H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/36 (2006.01); H01L 25/10 (2006.01); H01L 25/18 (2023.01)
CPC H01L 25/0657 (2013.01) [H01L 24/08 (2013.01); H01L 2224/08145 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06582 (2013.01); H01L 2225/06589 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
a first semiconductor chip;
a second semiconductor chip stacked on the first semiconductor chip; and
a plurality of third semiconductor chips sequentially stacked on the second semiconductor chip,
wherein a horizontal width of each of the first semiconductor chip and the second semiconductor chip is greater than a horizontal width of each of the plurality of third semiconductor chips,
the first semiconductor chip and the second semiconductor chip are connected to each other through direct contact of a bonding pad, and
a distance between adjacent ones of the plurality of third semiconductor chips is greater than a distance between the first semiconductor chip and the second semiconductor chip.