US 12,388,002 B2
Semiconductor device
Masayuki Kitamura, Kanagawa (JP)
Assigned to KIOXIA CORPORATION, Tokyo (JP)
Filed by Kioxia Corporation, Tokyo (JP)
Filed on Feb. 28, 2022, as Appl. No. 17/682,829.
Claims priority of application No. 2021-150516 (JP), filed on Sep. 15, 2021.
Prior Publication US 2023/0085314 A1, Mar. 16, 2023
Int. Cl. H01L 23/498 (2006.01); H01L 23/50 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/49838 (2013.01) [H01L 23/50 (2013.01); H01L 25/0657 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06531 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06586 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a substrate comprising a first interconnection configured to provide a first reference voltage, a second interconnection configured to provide a second reference voltage different from the first reference voltage, and at least one interconnection layer,
wherein the first interconnection comprises a plurality of first interconnection components that are provided in the interconnection layer,
wherein the second interconnection comprises a plurality of second interconnection components that are provided in the interconnection layer,
wherein the plurality of first interconnection components and the plurality of second interconnection components are alternately arranged in a first direction parallel to the interconnection layer,
wherein, when viewed from a second direction perpendicular to the first direction, the first interconnection component in the first interconnection layer and the first interconnection component in the second interconnection layer, which are electrically connected by one of the plurality of first columnar electrodes, are displaced from each other in the first direction by a distance between the first interconnection component and the second interconnection component, which are adjacent to each other in the same interconnection layer, in the first direction, and
wherein, when viewed from the second direction, the second interconnection component in the first interconnection layer and the second interconnection component in the second interconnection layer, which are electrically connected by one of the plurality of second columnar electrodes, are displaced from each other in the first direction by a distance between the first interconnection component and the second interconnection component, which are adjacent to each other in the same interconnection layer, in the first direction.