US 12,387,978 B2
Ru liner above a barrier layer
Zhaoxuan Wang, Sunnyvale, CA (US); Jianxin Lei, Fremont, CA (US); Wenting Hou, San Jose, CA (US); Sung-Kwan Kang, San Jose, CA (US); and Anand Nilakantan Iyer, Fremont, CA (US)
Assigned to APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Oct. 21, 2022, as Appl. No. 17/970,872.
Prior Publication US 2024/0136223 A1, Apr. 25, 2024
Prior Publication US 2024/0234204 A9, Jul. 11, 2024
Int. Cl. H01L 21/768 (2006.01); H01L 23/532 (2006.01)
CPC H01L 21/76841 (2013.01) [H01L 21/76829 (2013.01); H01L 23/53266 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A method to produce a layered substrate, comprising:
depositing a diffusion barrier layer on the substrate;
depositing an underlayer comprising a Group 6 metal on the barrier layer; and
depositing a ruthenium layer comprising ruthenium on the underlayer, to produce the layered substrate;
wherein the method further comprises annealing of the layered substrate by heating of the layered substrate at a temperature of greater than or equal to about 800° C. in an oxygen free environment, for a period of time of greater than or equal to about 5 seconds and less than or equal to about 500 seconds; and
wherein an upper surface of the annealed layered substrate has an average roughness Ra of less than or equal to about 10 nm, and/or the upper surface of the annealed layered substrate has a root mean square roughness Rq of less than or equal to about 10 nm.