US 12,387,969 B2
Substrate processing apparatus, substrate holding apparatus, and method of manufacturing semiconductor device
Keishin Yamazaki, Toyama (JP); and Norichika Yamagishi, Toyama (JP)
Assigned to KOKUSAI ELECTRIC CORPORATION, Tokyo (JP)
Filed by Kokusai Electric Corporation, Tokyo (JP)
Filed on Jan. 27, 2022, as Appl. No. 17/586,202.
Claims priority of application No. 2021-015035 (JP), filed on Feb. 2, 2021.
Prior Publication US 2022/0246463 A1, Aug. 4, 2022
Int. Cl. H01L 21/687 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01)
CPC H01L 21/68764 (2013.01) [H01L 21/67115 (2013.01); H01L 21/67748 (2013.01); H01L 21/67754 (2013.01); H01L 21/67778 (2013.01); H01L 21/68707 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A substrate processing apparatus, comprising:
a process chamber configured to process at least one substrate;
a microwave generator configured to generate a microwave;
a substrate holder configured to load and hold the at least one substrate; and
a rotator which includes an output shaft configured to support the substrate holder and an input shaft installed at an off-centered position with respect to the output shaft,
wherein a concave portion is formed in an upper portion of the input shaft and first gear teeth are formed on an inner circumference of the concave portion,
wherein second gear teeth are formed on an outer circumference of the output shaft, and
wherein the first gear teeth of the concave portion of the input shaft are fitted with the second gear teeth of the output shaft.