US 12,387,310 B2
Wafer signature local maxima via clustering for metrology guided inspection
Alan Davila, El Paso, TX (US); Marcus Liesching, Boulder Creek, CA (US); Sandeep Bhagwat, Milpitas, CA (US); Surya Vanamali, San Jose, CA (US); Suresh Selvaraj, Fremont, CA (US); Sravani Desu, Andhra Pradesh (IN); Ganesh Meenakshisundaram, Austin, TX (US); Karthik Purushothaman, Chennai (IN); and Ardis Liang, Pleasanton, CA (US)
Assigned to KLA Corporation, Milpitas, CA (US)
Filed by KLA Corporation, Milpitas, CA (US)
Filed on Feb. 9, 2024, as Appl. No. 18/438,382.
Claims priority of provisional application 63/472,596, filed on Jun. 13, 2023.
Claims priority of application No. 202341030828.0 (IN), filed on Apr. 29, 2023.
Prior Publication US 2024/0362765 A1, Oct. 31, 2024
Int. Cl. G06T 7/00 (2017.01); G06T 7/11 (2017.01)
CPC G06T 7/0004 (2013.01) [G06T 7/11 (2017.01); G06T 2207/20081 (2013.01); G06T 2207/30148 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system configured for generating information for use in setting up a process performed on a specimen, comprising:
one or more computer systems configured for:
clustering dies on a specimen based on colors assigned to the dies responsive to predicted defect densities in the dies determined from measurements performed on the specimen thereby generating initial die clusters;
analyzing the initial die clusters in location space to determine if any of the initial die clusters contain two or more die clusters;
designating the initial die clusters that do not contain two or more die clusters and the two or more die clusters contained in any of the initial die clusters as final die clusters; and
storing information for the final die clusters for use in setting up a process performed on the specimen.