US 12,386,340 B2
Systems and methods for generating post-polishing topography for enhanced wafer manufacturing
Vahid Khalajzadeh, O'Fallon, MO (US); and Sumeet S. Bhagavat, St. Charles, MO (US)
Assigned to GlobalWafers Co., Ltd., Hsinchu (TW)
Filed by GlobalWafers Co., Ltd., Hsinchu (TW)
Filed on Feb. 25, 2022, as Appl. No. 17/652,571.
Prior Publication US 2023/0274986 A1, Aug. 31, 2023
Int. Cl. G05B 19/418 (2006.01); H01L 21/66 (2006.01)
CPC G05B 19/41875 (2013.01) [H01L 22/20 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A computer device comprising at least one processor in communication with at least one memory device, wherein the at least one processor is programmed to:
store, in the at least one memory device, a model for converting shape maps to simulate a portion of an assembly line, wherein the model is a generative adversarial network (GAN) artificial intelligence model;
receive scan data of a first inspection of a product being assembled, wherein the first inspection is conducted at a first inspection station in the assembly line subsequent to a first device in the assembly line, wherein the first device is a grinder;
generate a shape map from the scan data of the first inspection;
execute the model using the shape map as an input to generate a final shape map of the product;
compare the final shape map to one or more thresholds;
determine if the final shape map exceeds at least one of the one or more thresholds; and
if the determination is made that the final shape map exceeds at least one of the one or more thresholds, cause the grinder to be adjusted.