US 12,385,127 B2
Film forming apparatus and film forming method
Yasunobu Suzuki, Yamanashi (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed on Sep. 28, 2023, as Appl. No. 18/477,060.
Claims priority of application No. 2022-163116 (JP), filed on Oct. 11, 2022.
Prior Publication US 2024/0117486 A1, Apr. 11, 2024
Int. Cl. C23C 14/34 (2006.01); C23C 14/16 (2006.01); C23C 14/50 (2006.01); H01J 37/32 (2006.01); H01J 37/34 (2006.01)
CPC C23C 14/3464 (2013.01) [C23C 14/16 (2013.01); C23C 14/505 (2013.01); H01J 37/32651 (2013.01); H01J 37/3447 (2013.01); H01J 37/3476 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A film forming apparatus for performing film formation on a substrate, comprising:
a processing chamber;
a stage configured to place thereon a substrate disposed in the processing chamber;
a first film forming part configured to perform film formation on the substrate placed on the stage;
a shutter that is movable between a shielding position where the substrate on the stage is shielded and a retracted position retracted from the stage and where the first film forming part performs the film formation on the substrate;
a film thickness measuring part having a film thickness measuring device configured to measure a film thickness of a film formed on the shutter at the shielding position by the first film forming part; and
a controller configured to control processing in the film forming apparatus,
wherein the controller determines film formation on the substrate based on a film thickness measurement result obtained by the film thickness measuring device, and
wherein a second film forming part is provided, and when abnormal film formation is detected from the film thickness measurement result after a film is formed on the shutter by the first film forming part, the controller controls the second film forming part to perform the film formation on the substrate.