US 12,384,673 B2
Method for manufacturing MEMS device and MEMS device
Ping-He Chang, Hsinchu (CN); and Kahkeen Lai, Singapore (SG)
Assigned to AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD., Shenzhen (CN)
Filed by AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD., Shenzhen (CN)
Filed on Dec. 1, 2022, as Appl. No. 18/073,472.
Application 18/073,472 is a continuation of application No. PCT/CN2022/121224, filed on Sep. 26, 2022.
Claims priority of application No. 202210973004.2 (CN), filed on Aug. 15, 2022.
Prior Publication US 2024/0051819 A1, Feb. 15, 2024
Int. Cl. B81C 1/00 (2006.01)
CPC B81C 1/00476 (2013.01) [B81C 2201/0105 (2013.01); B81C 2201/0132 (2013.01); B81C 2201/0133 (2013.01); B81C 2203/0172 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A method for manufacturing a MEMS device, comprising:
depositing a thin film on at least a part of a surface of a sacrificial layer;
depositing a structural layer on the surface of the sacrificial layer, wherein the structural layer has a hollow portion, and at least a part of the thin film is exposed through the hollow portion;
defining at least one through hole in the thin film by machining;
removing at least a part of a material covered by the thin film in the sacrificial layer, and discharging from the at least one through hole the part of the material removed from the sacrificial layer to define a cavity in the sacrificial layer; and
depositing a sealing layer on a surface of the thin film facing away from the sacrificial layer to seal the at least one through hole.