US 12,384,081 B2
Mould half and mould method for transfer moulding encapsulating electronic components mounted on a carrier including a dual support surface and a method for using such
Wilhelmus Gerardus Jozef Gal, Duiven (NL); and Albertus Franciscus Gerardus van Driel, Duiven (NL)
Assigned to Besi Netherlands B.V., Duiven (NL)
Appl. No. 17/286,992
Filed by Besi Netherlands B.V., Duiven (NL)
PCT Filed Oct. 22, 2019, PCT No. PCT/NL2019/050692
§ 371(c)(1), (2) Date Apr. 20, 2021,
PCT Pub. No. WO2020/085899, PCT Pub. Date Apr. 30, 2020.
Claims priority of application No. 2021845 (NL), filed on Oct. 22, 2018.
Prior Publication US 2021/0387389 A1, Dec. 16, 2021
Int. Cl. B29C 45/14 (2006.01); B29C 45/37 (2006.01); H01L 21/56 (2006.01); B29L 31/34 (2006.01)
CPC B29C 45/376 (2013.01) [B29C 45/14655 (2013.01); B29C 45/14819 (2013.01); H01L 21/565 (2013.01); B29L 2031/3406 (2013.01); H01L 21/561 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A mould half for a mould for transfer moulding encapsulating electronic components mounted on a carrier,
wherein a mould part to support the carrier has a contact surface that comprises a primary carrier support surface, wherein the primary carrier support surface is surrounded by a secondary surface, wherein the secondary surface is directly in contact with and supported by a wedge, wherein the wedge is displaceable by a drive for height adjustment of the secondary surface relative to the height of the primary carrier support surface, wherein the secondary surface comprises a moulding material feed support, and wherein the secondary surface is adjusted upward relative to the height of the primary carrier support surface to support a moulding material feed.