US 12,384,002 B2
Composite pad for chemical mechanical polishing
Zhan Liu, Hockessin, DE (US); Nan-Rong Chiou, Wilmington, DE (US); and Michael E. Mills, Bear, DE (US)
Assigned to Rohm and Haas Electronic Materials CMP Holdings, Inc., Newark, DE (US)
Filed by Rohm and Haas Electronic Materials CMP Holdings, Inc., Newark, DE (US)
Filed on Apr. 21, 2022, as Appl. No. 17/660,096.
Prior Publication US 2023/0339067 A1, Oct. 26, 2023
Int. Cl. B24B 37/24 (2012.01); B24B 37/26 (2012.01); C08L 27/18 (2006.01); C08L 75/04 (2006.01)
CPC B24B 37/24 (2013.01) [B24B 37/26 (2013.01); C08L 27/18 (2013.01); C08L 75/04 (2013.01)] 10 Claims
 
1. A chemical mechanical polishing pad comprising a substantially non-porous polishing layer, the polishing layer comprising a polymer matrix and agglomerates of polymer particles embedded in the polymer matrix wherein the polymer particles are present in amounts of 5 to 35 weight percent based on weight of the polishing layer, the agglomerates have a size of greater than 1 μm, the polymer particles have a tensile modulus higher than a tensile modulus of the polymer matrix, and the polishing layer is viscoelastic.