US 12,057,429 B1
Temporary bonding structures for die-to-die and wafer-to-wafer bonding
Aurelio Lopez, Malibu, CA (US); Peter Brewer, Westlake Village, CA (US); Partia Naghibi Mahmoudabadi, Thousand Oaks, CA (US); Erik Daniel, Malibu, CA (US); and Tahir Hussain, Malibu, CA (US)
Assigned to HRL LABORATORIES, LLC, Malibu, CA (US)
Filed by HRL Laboratories, LLC, Malibu, CA (US)
Filed on Jun. 23, 2021, as Appl. No. 17/356,387.
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 24/81 (2013.01) [H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 2224/13013 (2013.01); H01L 2224/13016 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13466 (2013.01); H01L 2224/14051 (2013.01); H01L 2224/16057 (2013.01); H01L 2224/80201 (2013.01); H01L 2224/80986 (2013.01); H01L 2224/81053 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81379 (2013.01)] 11 Claims
OG exemplary drawing
 
1. An electronic component, die or wafer, comprising:
a first array of microstructures on a major surface of the electronic component, die or wafer that project in a direction essentially normal to the major surface, the microstructures each terminating at a distal end thereof with an elongate edge spaced at a height h from the major surface; and
a second array of structures on the major surface having flat, planar surfaces spaced at a height h′ from the major surface, the height h′ being no more than one half the height h;
wherein the first array of microstructures are formed adjacent to and spaced apart from the second array of microstructures on the major surface of the electronic component;
wherein the first array of microstructures are configured to have a plurality of layers parallel to the major surface with alternating hardnesses,
wherein the first array of microstructures are configured to temporarily bond with a corresponding array of microstructures formed on a second electronic component, die or wafer, before the second array of structures permanently bonding with a corresponding array of structures of the second electronic component, die or wafer.