US 12,057,403 B2
Light engine based on silicon photonics TSV interposer
Liang Ding, Westlake Village, CA (US); and Radhakrishnan L. Nagarajan, Santa Clara, CA (US)
Assigned to MARVELL ASIA PTE LTD, Singapore (SG)
Filed by MARVELL ASIA PTE LTD, Singapore (SG)
Filed on May 26, 2023, as Appl. No. 18/202,666.
Application 18/202,666 is a continuation of application No. 17/843,407, filed on Jun. 17, 2022, granted, now 11,664,319.
Application 17/843,407 is a continuation of application No. 16/738,844, filed on Jan. 9, 2020, granted, now 11,367,687, issued on Jun. 21, 2022.
Application 16/738,844 is a continuation of application No. 15/887,758, filed on Feb. 2, 2018, granted, now 10,566,287, issued on Feb. 18, 2020.
Prior Publication US 2023/0299008 A1, Sep. 21, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/538 (2006.01); G02B 6/12 (2006.01); G02B 6/42 (2006.01); H01L 21/48 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2023.01)
CPC H01L 23/5384 (2013.01) [G02B 6/428 (2013.01); H01L 21/486 (2013.01); H01L 21/76898 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 25/167 (2013.01); G02B 2006/12061 (2013.01); H01L 21/768 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/157 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A pluggable optical communications device comprising:
a light engine comprising:
a silicon photonics interposer comprising a plurality of through-silicon vias (TSVs) and a plurality of mounting elements formed in the silicon photonics interposer;
circuitry disposed on the silicon photonics interposer and coupled to first terminals of the TSVs;
an optical fiber mounted into a first mounting element in the silicon photonics interposer;
a laser device disposed in a second mounting element in the silicon photonics interposer;
an optical coupler mounted in a third mounting element in the silicon photonics interposer, the optical coupler configured to provide optical coupling among the optical fiber, the laser device, and the circuitry through the silicon photonics interposer; and
a printed circuit board (PCB), the light engine being pluggable to the PCB via second terminals of the TSVs.