US D1,087,069 S
Electronic device cover
Jiacheng Yu, Shenzhen (CN); and Dario Distefano, Amsterdam (NL)
Assigned to Harman International Industries, Incorporated, Northridge, CA (US)
Filed by Harman International Industries, Incorporated, Northridge, CA (US)
Filed on Dec. 15, 2023, as Appl. No. 29/921,219.
Term of patent 15 Years
LOC (15) Cl. 14 - 03
U.S. Cl. D14—217
OG exemplary drawing
 
The ornamental design for an electronic device cover, as shown and described.