US 12,382,842 B2
Superconducting wire and method of forming the same
Seung-Hyun Moon, Seoul (KR); Judith Driscoll, Cambridge (GB); Ahmed Kurusumovic, Cambridge (GB); and John Feighan, Cambridge (GB)
Assigned to SUNAM CO., LTD., Anseong-si (KR); and CAMBRIDGE ENTERPRISE LIMITED, Cambridge (GB)
Filed by SUNAM CO., LTD., Anseong-si (KR); and CAMBRIDGE ENTERPRISE LIMITED, Cambridge (GB)
Filed on Apr. 14, 2021, as Appl. No. 17/230,118.
Claims priority of application No. 10-2020-0144923 (KR), filed on Nov. 3, 2020; and application No. 10-2021-0036349 (KR), filed on Mar. 22, 2021.
Prior Publication US 2022/0140222 A1, May 5, 2022
Int. Cl. H10N 60/01 (2023.01)
CPC H10N 60/0632 (2023.02) [H10N 60/0801 (2023.02); H10N 60/0828 (2023.02)] 11 Claims
OG exemplary drawing
 
1. A method of forming a superconducting wire, comprising:
forming a buffer layer on a substrate; and
providing a superconducting precursor on the buffer layer, to form a superconducting film including Y1-xRExBCO on the substrate,
wherein:
0<x≤1,
the superconducting film has a first composition ratio of Y+RE and Cu relative to Ba,
the superconducting precursor is provided using a source including Y+RE, Ba, and Cu,
the source has a second composition ratio of Y+RE and Cu relative to Ba, and
the second composition ratio is greater than the first composition ratio.