US 12,382,741 B2
Solid-state imaging element and electronic device
Takayuki Tanaka, Kanagawa (JP); and Tomohiko Baba, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Appl. No. 17/758,451
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Dec. 2, 2020, PCT No. PCT/JP2020/044823
§ 371(c)(1), (2) Date Jul. 6, 2022,
PCT Pub. No. WO2021/145082, PCT Pub. Date Jul. 22, 2021.
Claims priority of application No. 2020-003397 (JP), filed on Jan. 14, 2020.
Prior Publication US 2023/0036259 A1, Feb. 2, 2023
Int. Cl. H10F 39/00 (2025.01)
CPC H10F 39/8057 (2025.01) 10 Claims
OG exemplary drawing
 
1. A solid-state imaging element, comprising:
a pixel region including a plurality of pixels;
a chip mounting region;
a chip on the chip mounting region; and
a dam region around the chip mounting region, wherein
the dam region includes a plurality of first on-chip lenses connected in a zigzag manner,
the dam region has a saw-tooth shape,
the saw-tooth shape of the dam region is based on the connection of the plurality of first on-chip lenses in the zigzag manner, and
the saw-tooth shape is toward an outer side of the dam region.