US 12,382,615 B2
Electronic apparatus with channeled cooling
Gustavo Dario Leizerovich, Aventura, FL (US); Ivan Quiroz, Dallas, TX (US); Claudio Santiago Ribeiro, Evanston, IL (US); and Cesar Eduardo Nunez, Miramar, FL (US)
Assigned to Ubicquia, Inc., Fort Lauderdale, FL (US)
Filed by Ubicquia, Inc., Fort Lauderdale, FL (US)
Filed on Sep. 30, 2023, as Appl. No. 18/375,493.
Application 18/375,493 is a continuation of application No. 17/563,783, filed on Dec. 28, 2021, granted, now 11,792,964.
Prior Publication US 2024/0032263 A1, Jan. 25, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20909 (2013.01) 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a housing including a floor and at least one sidewall portion extending around a perimeter of the floor, the at least one sidewall portion including an air intake section located at a first end of the floor and a first air exhaust section located at a second end of the floor, the floor including a first floor portion residing primarily in a first plane, a second floor portion residing primarily in a second plane, and a transition portion interconnecting the first floor portion and the second floor portion, the transition portion including a second air exhaust section; and
at least one heat-generating electrical module positioned over and spaced apart from the floor, wherein at least one air flow channel is defined between one or more inside surfaces of the floor and at least one external surface of the at least one heat-generating electrical module.