US 12,382,600 B2
Electronic device housing, manufacturing method thereof, and electronic device
Lan Ma, Shenzhen (CN); Haiyan Jin, Shenzhen (CN); and Liang Chen, Shenzhen (CN)
Assigned to BYD COMPANY LIMITED, Shenzhen (CN)
Appl. No. 17/418,530
Filed by BYD COMPANY LIMITED, Shenzhen (CN)
PCT Filed Apr. 29, 2019, PCT No. PCT/CN2019/085006
§ 371(c)(1), (2) Date Jun. 25, 2021,
PCT Pub. No. WO2020/133858, PCT Pub. Date Jul. 2, 2020.
Claims priority of application No. 201811642127.8 (CN), filed on Dec. 29, 2018.
Prior Publication US 2022/0104376 A1, Mar. 31, 2022
Int. Cl. H05K 5/03 (2006.01); H04B 1/3888 (2015.01)
CPC H05K 5/03 (2013.01) [H04B 1/3888 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A method for manufacturing an electronic device housing, comprising:
cleaning surfaces of components to be welded to obtain surface-cleaned components, and
assembling, pre-pressurizing, and welding the surface-cleaned components, to make the connection between the components to be welded continuous and interface-free,
wherein the component to be welded comprises at least a middle frame and a bottom plate, the middle frame is made of glass, and the bottom plate is made of sapphire; or the bottom plate is made of glass, and the middle frame is made of sapphire.
 
6. An electronic device housing manufactured using the method according to claim 1.