US 12,382,578 B2
Method for manufacturing wiring circuit board
Hayato Takakura, Osaka (JP); Naoki Shibata, Osaka (JP); and Yasunari Oyabu, Osaka (JP)
Assigned to NITTO DENKO CORPORATION, Osaka (JP)
Appl. No. 17/768,758
Filed by NITTO DENKO CORPORATION, Osaka (JP)
PCT Filed Sep. 15, 2020, PCT No. PCT/JP2020/034940
§ 371(c)(1), (2) Date Apr. 13, 2022,
PCT Pub. No. WO2021/075195, PCT Pub. Date Apr. 22, 2021.
Claims priority of application No. 2019-189408 (JP), filed on Oct. 16, 2019.
Prior Publication US 2024/0114615 A1, Apr. 4, 2024
Int. Cl. H05K 1/02 (2006.01); H05K 1/05 (2006.01); H05K 1/09 (2006.01); H05K 3/16 (2006.01)
CPC H05K 1/0269 (2013.01) [H05K 1/05 (2013.01); H05K 1/09 (2013.01); H05K 3/16 (2013.01); H05K 2201/2054 (2013.01); H05K 2203/163 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A method for manufacturing a wiring circuit board, the method comprising the steps of:
providing a metal supporting layer, a different-reflectance layer, an insulating layer, and a wiring layer sequentially toward one side in a thickness direction; and
irradiating the wiring circuit board with inspection light containing one wavelength in light between wavelengths of 650 nm or more and 950 nm or less from one side in the thickness direction of the wiring circuit board to inspect an outer shape of the wiring layer based on reflected light reflected at the wiring circuit board,
wherein in the irradiating step, the wiring layer is inspected based on a contrast between first reflected light reflected at one surface in the thickness direction of the wiring layer and second reflected light reflected at one surface in the thickness direction of the different-reflectance layer, and
wherein a difference between a reflectance R1 of the wiring layer with respect to the light with the one wavelength and a reflectance R2 of the different-reflectance layer with respect to the light with the one wavelength is 40% or more.