US 12,382,574 B2
Electronic element, circuit board with electronic element, and electronic device
Chenyang He, Shanghai (CN); Ruiming Mo, Shanghai (CN); and Jie Sun, Shanghai (CN)
Assigned to HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed by HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed on Jun. 10, 2022, as Appl. No. 17/837,445.
Application 17/837,445 is a continuation of application No. PCT/CN2019/125365, filed on Dec. 13, 2019.
Prior Publication US 2022/0304138 A1, Sep. 22, 2022
Int. Cl. H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/0203 (2013.01) [H05K 1/0213 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 2201/09036 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An electronic element, comprising:
an impedance matching circuit;
a substrate;
a first input pad on a first surface of the substrate;
at least one chip on the first surface of the substrate; and
a first output pad on the first surface of the substrate,
wherein
the first input pad, the at least one chip, and the first output pad are sequentially connected,
the first input pad and the first output pad are in direct physical contact with the first surface of the substrate,
a surface of the first input pad facing away from the substrate and a surface of the first output pad facing away from the substrate constitute a partial area of an outer surface of the electronic element,
the first input pad, the at least one chip, and the first output pad are connected through the impedance matching circuit, and
the impedance matching circuit is in a groove defined in a circuit board opposite to the impedance matching circuit.