US 12,382,456 B2
High frequency multi-link support systems operation
Abhishek Pramod Patil, San Diego, CA (US); George Cherian, San Diego, CA (US); Alfred Asterjadhi, San Diego, CA (US); Gaurang Naik, San Diego, CA (US); Yanjun Sun, San Diego, CA (US); Sai Yiu Duncan Ho, San Diego, CA (US); and Abdel Karim Ajami, Lakeside, CA (US)
Assigned to QUALCOMM Incorporated, San Diego, CA (US)
Filed by QUALCOMM Incorporated, San Diego, CA (US)
Filed on Jun. 29, 2022, as Appl. No. 17/853,668.
Prior Publication US 2024/0008039 A1, Jan. 4, 2024
Int. Cl. H04W 72/20 (2023.01); H04W 16/28 (2009.01); H04W 56/00 (2009.01); H04W 76/15 (2018.01)
CPC H04W 72/20 (2023.01) [H04W 16/28 (2013.01); H04W 56/004 (2013.01); H04W 76/15 (2018.02)] 30 Claims
OG exemplary drawing
 
1. A first multi-link device (MLD) for wireless communications, comprising:
a processing system that includes one or more processors and one or more memories coupled with the one or more processors, the processing system configured to cause the first MLD to:
obtain, via a first radio frequency link, identifying information associated with a second radio frequency link in accordance with a multi-link operation between the first MLD and a second MLD;
obtain, via the first radio frequency link, control information associated with communications using the second radio frequency link, wherein the communications using the second radio frequency link are associated with a configuration for directional transmissions between the first MLD and the second MLD; and
output, to the second MLD via the second radio frequency link, one or more data messages in accordance with the control information.