US 12,382,217 B2
Sound wave signal processing apparatus and sound wave detection method
Kenichi Sato, Tokyo (JP); Atsushi Nishio, Tokyo (JP); and Satoshi Kasahara, Tokyo (JP)
Assigned to Asahi Kasei Microdevices Corporation, Tokyo (JP)
Filed by Asahi Kasei Microdevices Corporation, Tokyo (JP)
Filed on May 23, 2023, as Appl. No. 18/322,547.
Claims priority of application No. 2022-094592 (JP), filed on Jun. 10, 2022.
Prior Publication US 2023/0412973 A1, Dec. 21, 2023
Int. Cl. H04B 3/00 (2006.01); H04R 1/10 (2006.01); H04R 1/32 (2006.01); H03G 3/00 (2006.01)
CPC H04R 1/32 (2013.01) [H04R 1/1083 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A sound wave signal processing apparatus comprising:
an extraction unit configured to extract, from a sound wave signal, a plurality of frequency signals indicating respective frequency components of a plurality of frequency bands including different set frequencies;
a setting unit configured to set a set frequency of the extraction unit on a basis of a comparison result between output levels of the frequency signals of the different set frequencies extracted by the extraction unit; and
a detection unit configured to detect a formant frequency band including a formant frequency in the sound wave signal on a basis of a comparison result group between the output levels of the frequency signals of the different set frequencies extracted by the extraction unit, a setting history of the set frequency of the extraction unit by the setting unit, and a frequency characteristic of the extraction unit.