US 12,382,212 B2
Bone conduction acoustic device, method for assembling bone conduction acoustic device and bone conduction earphone
Hongbin Cao, Jiangsu (CN); Jialong Shen, Jiangsu (CN); and Juan Chen, Jiangsu (CN)
Assigned to Suzhou Thor Electronic Technology Co., Ltd., Jiangsu (CN)
Filed by Suzhou Thor Electronic Technology Co., Ltd., Jiangsu (CN)
Filed on Sep. 13, 2022, as Appl. No. 17/944,168.
Claims priority of application No. 202111101481.1 (CN), filed on Sep. 18, 2021.
Prior Publication US 2023/0100866 A1, Mar. 30, 2023
Int. Cl. H04R 1/10 (2006.01); H04R 1/02 (2006.01); H04R 9/02 (2006.01); H04R 31/00 (2006.01)
CPC H04R 1/1091 (2013.01) [H04R 1/02 (2013.01); H04R 9/025 (2013.01); H04R 31/00 (2013.01); H04R 2460/13 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A bone conduction acoustic device, comprising:
a case, including a base case portion and a side case portion connected with the base case portion, a cavity with an opening at one end is formed between the base case portion and the side case portion;
a cover, connected to the side case portion and sealing the opening, wherein the cover has a contact surface for contacting a skin of a user's head;
a magnet assembly, connected to the cover, and located in the cavity;
a voice coil assembly, arranged in the cavity, and arranged opposite to the magnet assembly for driving the magnet assembly to vibrate; and
a circuit board, arranged in the cavity, and electrically connected to the voice coil assembly, the circuit board is located between the base case portion and the voice coil assembly.