US 12,381,591 B2
Radio-frequency module and communication apparatus
Takanori Uejima, Kyoto (JP); and Hiromichi Kitajima, Kyoto (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on Feb. 2, 2023, as Appl. No. 18/163,320.
Application 18/163,320 is a continuation of application No. PCT/JP2021/032657, filed on Sep. 6, 2021.
Claims priority of application No. 2020-160216 (JP), filed on Sep. 24, 2020.
Prior Publication US 2023/0179248 A1, Jun. 8, 2023
Int. Cl. H04B 1/38 (2015.01); H03F 3/24 (2006.01); H04B 1/00 (2006.01); H04B 1/04 (2006.01)
CPC H04B 1/38 (2013.01) [H03F 3/245 (2013.01); H03F 2200/294 (2013.01); H03F 2200/451 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A radio-frequency module comprising:
a module substrate having a first major face and a second major face, the first major face and the second major face being opposite to each other;
a first circuit component disposed over the first major face;
a second circuit component disposed over the second major face;
a plurality of external connection terminals disposed over the second major face; and
a metal shield plate disposed over the second major face and extending in a direction perpendicular to the second major face, the metal shield plate being set to a ground potential,
wherein the plurality of external connection terminals include a first external connection terminal and a second external connection terminal, the first external connection terminal being an external connection terminal through which a first radio-frequency signal is inputted or outputted, the second external connection terminal being an external connection terminal through which one of a power supply signal, a control signal, and a second radio-frequency signal is inputted or outputted,
wherein the metal shield plate has a recess in at least one of end portions being opposite to each other in the direction perpendicular to the second major face, and
wherein with the module substrate seen in plan view, the metal shield plate is disposed between the first external connection terminal and the second external connection terminal, or between the second external connection terminal and the second circuit component.