US 12,381,532 B2
Bulk acoustic wave device with integrated temperature sensor and heater
Keegan Shaun Martin, Dallas, TX (US); and Ting-Ta Yen, San Jose, CA (US)
Assigned to Texas Instruments Incorporated, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Jun. 11, 2021, as Appl. No. 17/345,644.
Claims priority of provisional application 63/132,704, filed on Dec. 31, 2020.
Claims priority of provisional application 63/092,087, filed on Oct. 15, 2020.
Prior Publication US 2022/0123715 A1, Apr. 21, 2022
Int. Cl. H03H 9/08 (2006.01); H03H 3/04 (2006.01); H03H 9/02 (2006.01); H03H 9/17 (2006.01); H03H 3/02 (2006.01)
CPC H03H 9/08 (2013.01) [H03H 3/04 (2013.01); H03H 9/02102 (2013.01); H03H 9/175 (2013.01); H03H 2003/025 (2013.01); H03H 2003/0407 (2013.01)] 22 Claims
OG exemplary drawing
 
1. An acoustic-wave device, comprising:
a first electrode located over a substrate;
a piezoelectric layer over the first electrode;
a second electrode over the piezoelectric layer and at least partially overlapping the first electrode; and
a temperature sensor in a same layer level as the first or second electrode.