US 12,381,465 B2
Lens moving apparatus and camera module including same
Sang Ok Park, Seoul (KR); Kyoung Ho Yoo, Seoul (KR); Sung Guk Lee, Seoul (KR); Seong Min Lee, Seoul (KR); Jun Taek Lee, Seoul (KR); and Byung Wook Son, Seoul (KR)
Assigned to LG INNOTEK CO., LTD., Seoul (KR)
Filed by LG INNOTEK CO., LTD., Seoul (KR)
Filed on Oct. 17, 2023, as Appl. No. 18/488,591.
Application 18/488,591 is a continuation of application No. 17/226,341, filed on Apr. 9, 2021, granted, now 11,824,418.
Application 17/226,341 is a continuation of application No. 16/580,627, filed on Sep. 24, 2019, granted, now 11,005,353, issued on May 11, 2021.
Application 16/580,627 is a continuation of application No. 15/548,697, granted, now 10,468,959, issued on Nov. 5, 2019, previously published as PCT/KR2016/001064, filed on Feb. 1, 2016.
Claims priority of application No. 10-2015-0017225 (KR), filed on Feb. 4, 2015; and application No. 10-2015-0033565 (KR), filed on Mar. 11, 2015.
Prior Publication US 2024/0048038 A1, Feb. 8, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H02K 41/035 (2006.01); G02B 7/09 (2021.01); G02B 27/08 (2006.01); G02B 27/64 (2006.01); G03B 3/10 (2021.01); G03B 13/36 (2021.01); H02K 11/21 (2016.01); H02K 33/18 (2006.01)
CPC H02K 41/0356 (2013.01) [G02B 7/09 (2013.01); G02B 27/08 (2013.01); G02B 27/646 (2013.01); G03B 3/10 (2013.01); G03B 13/36 (2013.01); H02K 11/21 (2016.01); H02K 33/18 (2013.01); G03B 2205/0007 (2013.01); G03B 2205/0069 (2013.01); H02K 2201/18 (2013.01); H02K 2203/12 (2013.01); H02K 2205/00 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A lens driving device comprising:
a cover member;
a housing disposed in the cover member;
a bobbin disposed in the housing;
a base below the housing;
a first coil disposed on the bobbin;
a magnet disposed on the housing and facing the first coil;
a circuit board disposed on the base and comprising a second coil facing the magnet;
an upper elastic member connecting the housing and the bobbin; and
a support member electrically connecting the upper elastic member and the circuit board,
wherein a portion of the upper elastic member is disposed on an upper surface of the housing,
wherein the housing comprises a first groove recessed from the upper surface of the housing and a second groove recessed from the first groove,
wherein the second groove comprises a floor surface facing the upper elastic member,
wherein the housing comprises a hole formed on the floor surface of the second groove, and
wherein the support member passes through the hole of the housing.