US 12,381,381 B2
Sensor devices with busbar and sensor chip and dielectrics arranged therebetween
Rainer Markus Schaller, Aichen (DE); Volker Strutz, Tegernheim (DE); Ronak Kalhor-Witzel, Neubiberg (DE); and Hansjoerg Walter Kuemmel, Munich (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Dec. 22, 2022, as Appl. No. 18/145,319.
Claims priority of application No. 102022100978.5 (DE), filed on Jan. 17, 2022.
Prior Publication US 2023/0268727 A1, Aug. 24, 2023
Int. Cl. H01G 4/224 (2006.01); H02G 5/00 (2006.01)
CPC H02G 5/005 (2013.01) [H01G 4/224 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A sensor device, comprising:
a busbar;
a dielectric shell arranged over the busbar;
a dielectric layer arranged over the busbar; and
a sensor chip arranged within the dielectric shell, wherein the sensor chip is configured to detect a magnetic field induced by an electric current flowing through the busbar.