	US 12,381,169 B2
	Semiconductor package
Soojeoung Park, Hwaseong-si (KR); Heeseok Lee, Suwon-si (KR); and Hei Seung Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Feb. 22, 2024, as Appl. No. 18/584,469.
Application 18/584,469 is a division of application No. 17/036,144, filed on Sep. 29, 2020, abandoned.
Claims priority of application No. 10-2020-0020634 (KR), filed on Feb. 19, 2020.
Prior Publication US 2024/0194626 A1, Jun. 13, 2024
Int. Cl. H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01)

CPC H01L 24/09 (2013.01) [H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 23/3128 (2013.01); H01L 23/5389 (2013.01); H01L 2224/02313 (2013.01); H01L 2224/02333 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/08112 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/08265 (2013.01); H01L 2224/0903 (2013.01); H01L 2224/09103 (2013.01); H01L 2224/16112 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16265 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19103 (2013.01)]

13 Claims

1. A semiconductor package comprising:

a redistribution layer;

a semiconductor chip provided on the redistribution layer and having a first surface and a second surface opposite to the first surface, the semiconductor chip including a first chip pad and a second chip pad which are exposed at the first surface;

a capacitor chip disposed between the first surface and the redistribution layer and extended across the first surface from a first sidewall of the semiconductor chip to a second sidewall of the semiconductor chip, the capacitor chip including

a through hole extending through the capacitor chip, and

a capacitor chip pad in direct physical contact with the first chip pad; and

a through structure extending through the through hole and being in direct physical contact with the second chip pad and connected to the redistribution layer.