US 12,381,106 B2
Systems and methods of seasoning electrostatic chucks with dielectric seasoning films
Akhil Singhal, Portland, OR (US); Allison Yau, Cupertino, CA (US); Zeqiong Zhao, Santa Clara, CA (US); Sang-Jin Kim, San Jose, CA (US); Zhijun Jiang, San Jose, CA (US); Deenesh Padhi, Sunnyvale, CA (US); and Ganesh Balasubramanian, Fremont, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on May 5, 2023, as Appl. No. 18/143,895.
Application 18/143,895 is a continuation of application No. 17/073,071, filed on Oct. 16, 2020, granted, now 11,646,216.
Prior Publication US 2023/0274968 A1, Aug. 31, 2023
Int. Cl. H01L 21/683 (2006.01); C25D 7/00 (2006.01); H02N 13/00 (2006.01)
CPC H01L 21/6833 (2013.01) [C25D 7/00 (2013.01); H01L 21/683 (2013.01); H02N 13/00 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A substrate support assembly comprising:
an electrostatic chuck body defining a substrate support assembly comprising a substrate support surface, wherein the electrostatic chuck body is seasoned with a seasoning layer, wherein the seasoning layer is carbon free, and wherein the seasoning layer is formed from deposition precursors comprising molecular oxygen;
a support stem coupled to the electrostatic chuck body; and
an electrode embedded within the electrostatic chuck body between the substrate support surface and the support stem, wherein the seasoning layer maintains a leakage current of the electrostatic chuck body at less than or about 25 mA at voltages of greater than or about 500 V.