US 12,381,099 B2
Die ejecting apparatus for bonding equipment
Hee Cheol Lee, Pyeongtaek-si (KR)
Assigned to SEMES CO., LTD., Cheonan-si (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Jul. 21, 2022, as Appl. No. 17/870,109.
Claims priority of application No. 10-2021-0096691 (KR), filed on Jul. 22, 2021.
Prior Publication US 2023/0022883 A1, Jan. 26, 2023
Int. Cl. H01L 21/67 (2006.01); H01L 21/68 (2006.01)
CPC H01L 21/67132 (2013.01) [H01L 21/67144 (2013.01); H01L 21/68 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A die ejecting apparatus, comprising:
an ejector body having a cylindrical shape;
ejector pins provided inside the ejector body, wherein the ejector pins are move up and down within the ejector body;
a hood coupled to an upper portion of the ejector body and made of a light-transmitting material, wherein the hood includes through holes through which the ejector pins pass;
a reinforcement member disposed in a form of a mesh mounted on the hood and overlapping the through holes; and
a light emitting unit positioned in an inner space of the ejector body to emit light toward the hood.