US 12,381,084 B2
Apparatus and method for treating substrate
Hyun Yoon, Hwaseong-si (KR); Ki Hoon Choi, Cheonan-si (KR); Tae Hee Kim, Yongin-si (KR); Hyo Won Yang, Seoul (KR); Young Dae Chung, Incheon (KR); and Ji Hoon Jeong, Hwaseong-si (KR)
Assigned to Semes Co., Ltd., Chungcheongnam-do (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Sep. 13, 2022, as Appl. No. 17/943,452.
Claims priority of application No. 10-2021-0121607 (KR), filed on Sep. 13, 2021.
Prior Publication US 2023/0084076 A1, Mar. 16, 2023
Int. Cl. H01L 21/268 (2006.01); H01L 21/311 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/268 (2013.01) [H01L 21/67028 (2013.01); H01L 21/67115 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A substrate treating apparatus comprising:
a support unit configured to support a substrate having a first pattern and a second pattern which is formed at a different position from the first pattern;
a liquid supply unit for supplying a treating liquid to the substrate supported on the support unit;
a heating unit configured to irradiate a laser to the substrate to which the treating liquid is supplied and to heat any one among the first pattern or the second pattern; and
an error checking unit configured to check an error between an irradiation position of the laser and a target position which is preset.