US 12,381,083 B2
Bonding apparatus and bonding method
Toshifumi Inamasu, Koshi (JP); and Shinichi Shinozuka, Koshi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Apr. 28, 2022, as Appl. No. 17/661,100.
Application 17/661,100 is a continuation of application No. 16/884,291, filed on May 27, 2020, granted, now 11,348,791.
Claims priority of application No. 2019-099179 (JP), filed on May 28, 2019.
Prior Publication US 2022/0254636 A1, Aug. 11, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. B32B 41/00 (2006.01); B23P 19/10 (2006.01); B23P 21/00 (2006.01); B23Q 17/22 (2006.01); B23Q 17/24 (2006.01); H01L 21/18 (2006.01); H01L 21/67 (2006.01); H01L 21/68 (2006.01)
CPC H01L 21/187 (2013.01) [B23P 19/10 (2013.01); B23P 21/00 (2013.01); B23Q 17/22 (2013.01); B23Q 17/24 (2013.01); B23Q 17/2428 (2013.01); H01L 21/67121 (2013.01); H01L 21/681 (2013.01); Y10T 29/5317 (2015.01); Y10T 156/10 (2015.01)] 12 Claims
OG exemplary drawing
 
1. A bonding apparatus configured to bond a first substrate and a second substrate, comprising:
a first holder configured to hold the first substrate;
a second holder configured to hold the second substrate;
a first imaging device provided at the first holder and configured to image the second substrate held by the second holder;
a first light irradiating device provided at the first holder and configured to irradiate light to the second substrate when the second substrate is imaged by the first imaging device;
a second imaging device provided at the second holder and configured to image the first substrate held by the first holder; and
a second light irradiating device provided at the second holder and configured to irradiate light to the first substrate when the first substrate is imaged by the second imaging device,
wherein first light sources for irradiating white light are provided independently and respectively for the first light irradiating device and the second light irradiating device.