US 12,381,036 B2
Manufacturing method of capacitor component
Eung Seok Lee, Suwon-si (KR); Tae Gyun Kwon, Suwon-si (KR); So Hyeon Hong, Suwon-si (KR); and Tae Sung Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Dec. 27, 2021, as Appl. No. 17/562,386.
Claims priority of application No. 10-2021-0135759 (KR), filed on Oct. 13, 2021.
Prior Publication US 2023/0115369 A1, Apr. 13, 2023
Int. Cl. H01G 4/012 (2006.01); B41M 3/00 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/012 (2013.01) [B41M 3/00 (2013.01); H01G 4/30 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A manufacturing method of a capacitor component, comprising:
forming a dielectric green sheet; and
inkjet printing a conductive pattern on the dielectric green sheet, wherein the inkjet printing the conductive pattern includes:
inkjet printing a base pattern on the dielectric green sheet, wherein the base pattern, after drying, has an average thickness in a central portion of the base pattern in the width direction that is thicker than an average thickness of both end portions of the base pattern in the width direction; and
inkjet printing a reinforcing pattern on at least a portion of each of both end portions of the base pattern in a width direction of the dielectric green sheet,
wherein each of the printed reinforcing patterns is thinner toward the central portion of the base pattern in the width direction compared to the thickness of the reinforcing pattern toward the end portion of the base pattern in the width direction.