US 12,381,029 B2
Stepped coax MIL PTHS for modulating inductance within a package
Brandon C. Marin, Chandler, AZ (US); Krishna Bharath, Phoenix, AZ (US); Haifa Hariri, Phoenix, AZ (US); and Tarek A. Ibrahim, Mesa, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Sep. 25, 2020, as Appl. No. 17/033,354.
Prior Publication US 2022/0102055 A1, Mar. 31, 2022
Int. Cl. H01F 27/28 (2006.01); H01F 17/00 (2006.01); H01F 41/04 (2006.01); H01F 41/14 (2006.01); H01F 41/32 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/64 (2006.01)
CPC H01F 27/2804 (2013.01) [H01F 17/0013 (2013.01); H01F 41/041 (2013.01); H01F 41/046 (2013.01); H01L 21/481 (2013.01); H01L 21/486 (2013.01); H01L 23/49827 (2013.01); H01L 23/645 (2013.01); H01F 2017/002 (2013.01); H01F 41/14 (2013.01); H01F 41/32 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An electronic package, comprising:
a package core;
a plated through hole (PTH) through a thickness of the package core; and
a magnetic shell around a perimeter of the PTH, wherein a height of the magnetic shell is less than the thickness of the package core, wherein the magnetic shell comprises a vertical sidewall and a bottom surface that is tapered, and wherein the PTH is plugged with an insulative material.