US 12,379,934 B2
Decoupling silicon initialization and bootloader by providing silicon initialization service
Di Zhang, Shanghai (CN); Sarathy Jayakumar, Portland, OR (US); Vincent Zimmer, Issaquah, WA (US); Fei Li, Shanghai (CN); Bo He, Shanghai (CN); Zhuangzhi Li, Shanghai (CN); Zhi Jin, Shanghai (CN); Lin Chen, Huaihua (CN); and Guomin Jiang, Shanghai (CN)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Sep. 28, 2021, as Appl. No. 17/449,098.
Claims priority of application No. PCT/CN2021/094995 (WO), filed on May 20, 2021.
Prior Publication US 2022/0019444 A1, Jan. 20, 2022
Int. Cl. G06F 9/00 (2018.01); G06F 1/24 (2006.01); G06F 9/4401 (2018.01)
CPC G06F 9/4405 (2013.01) [G06F 1/24 (2013.01)] 22 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a first set of processor cores including at least one processor core; and
a second set of processor cores including at least one processor core,
wherein the electronic device is configured such that during initialization of the electronic device:
the first set of processor cores executes first initialization instructions in a first execution environment,
the second set of processor cores executes second initialization instructions in a second execution environment, and
the first set and the second set at least one of read or write to a shared register.