US 12,379,768 B2
Electronic device and method of controlling temperature associated with a semiconductor device using dynamic voltage frequency scaling (DVFS)
Young San Kim, Yongin-si (KR); Jae Gon Lee, Seongnam-si (KR); Jae Young Lee, Hwaseong-si (KR); and Woo Kyeong Jeong, Seongnam-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Sep. 23, 2022, as Appl. No. 17/951,540.
Claims priority of application No. 10-2021-0184812 (KR), filed on Dec. 22, 2021; and application No. 10-2022-0031319 (KR), filed on Mar. 14, 2022.
Prior Publication US 2023/0195207 A1, Jun. 22, 2023
Int. Cl. G06F 1/3296 (2019.01)
CPC G06F 1/3296 (2013.01) 20 Claims
OG exemplary drawing
 
15. A method of controlling temperature in an electronic device including an intellectual property (IP) block, the method comprising:
generating an operating clock using a Phase-Locked Loop (PLL);
providing the operating clock to the IP block, wherein a temperature of the IP block is related to a frequency of the operating clock;
providing a supply voltage to a critical path monitor (CPM) of a dynamic voltage frequency scaling (DVFS) block, the DVFS block being configured to perform dynamic voltage frequency scaling on the IP block, and the CPM being configured to generate a speed code that indicates an operating speed of the operating clock;
determining a target frequency for the operating clock;
determining, based upon the speed code, a current frequency for the operating clock;
comparing the target frequency and the current frequency to generate frequency comparison results;
generating deciding results in response to the frequency comparison results; and
controlling a level of the supply voltage in response to the deciding results.