US 12,379,556 B2
Package structure having grating coupler and manufacturing method thereof
Feng-Wei Kuo, Hsinchu County (TW); Chewn-Pu Jou, Hsinchu (TW); Hsing-Kuo Hsia, Hsinchu County (TW); and Chih-Wei Tseng, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on May 1, 2024, as Appl. No. 18/652,775.
Application 18/652,775 is a continuation of application No. 17/896,089, filed on Aug. 26, 2022, granted, now 12,007,611.
Prior Publication US 2024/0280765 A1, Aug. 22, 2024
Int. Cl. G02B 6/42 (2006.01); G02B 6/293 (2006.01)
CPC G02B 6/4215 (2013.01) [G02B 6/29328 (2013.01); G02B 6/4206 (2013.01); G02B 6/4274 (2013.01)] 20 Claims
OG exemplary drawing
 
9. A package structure, comprising:
a first photonic die including a first grating material layer with a first grating coupler configured to receive and transmit a light beam;
a second photonic die, disposed beside and adjacent to the first photonic die and including a second grating material layer with a second grating coupler configured to transmit and emit the light beam;
a first electronic die disposed over the first photonic die, wherein the first electronic die includes a first lens;
a second electronic die disposed over the second photonic die, wherein the second electronic die includes a second lens; and
an interposer structure, disposed below the first and second photonic dies and including a third grating material layer with a third grating coupler configured to waveguide the light beam,
wherein the first and second photonic dies are optically coupled through the light beam waveguided between the first, third, and second grating couplers.