US 12,379,548 B2
Chiplet communication using an optical communication substrate
Clifford Chao, Palo Alto, CA (US); and Darius Bunandar, Boston, MA (US)
Assigned to Lightmatter, Inc., Boston, MA (US)
Filed by Lightmatter, Inc., Boston, MA (US)
Filed on Dec. 18, 2023, as Appl. No. 18/542,974.
Claims priority of provisional application 63/433,560, filed on Dec. 19, 2022.
Prior Publication US 2024/0201444 A1, Jun. 20, 2024
Int. Cl. G02B 6/35 (2006.01)
CPC G02B 6/3596 (2013.01) 16 Claims
OG exemplary drawing
 
1. A method for manufacturing a computing system, comprising:
obtaining a photonic interposer having an optical network comprising a plurality of optical switches including at least a first optical switch and a second optical switch and one or more waveguides optically coupling the first optical switch to the second optical switch;
bonding a first electronic die to the photonic interposer through a first surface of the first electronic die, wherein bonding the first electronic die comprises connecting the first electronic die to the photonic interposer through a first interface comprising a first two-dimensional array of ports arranged in at least three columns and at least three rows, wherein the first interface comprises:
a first inner interface comprising a first plurality of ports of the first two-dimensional array of ports electrically coupling the first electronic die to the photonic interposer through the first surface; and
a first outer interface comprising a second plurality of ports of the first two-dimensional array of ports electrically coupling the first electronic die to the photonic interposer through the first surface, wherein the first outer interface at least partially encloses the first inner interface,
wherein the first electronic die, when bonded to the photonic interposer, is associated with the first optical switch such that the first optical switch is configured to selectively couple the first electronic die to the one or more optical waveguides; and
bonding a second electronic die to the photonic interposer through a second surface of the second electronic die, wherein bonding the second electronic die comprises connecting the second electronic die to the photonic interposer through a second interface comprising a second two-dimensional array of ports arranged in at least three columns and at least three rows, wherein the second interface comprises:
a second inner interface comprising a third plurality of ports of the second two-dimensional array of ports electrically coupling the second electronic die to the photonic interposer through the second surface; and
a second outer interface comprising a fourth plurality of ports of the second two-dimensional array of ports electrically coupling the second electronic die to the photonic interposer through the second surface, wherein the second outer interface at least partially encloses the second inner interface,
wherein the second electronic die, when bonded to the photonic interposer, is associated with the second optical switch such that the second optical switch is configured to selectively couple the second electronic die to the one or more optical waveguides.