US 12,379,510 B2
Radiation detector and radiation image capturing system
Kunihito Ide, Kanagawa (JP)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on May 10, 2023, as Appl. No. 18/314,934.
Claims priority of application No. 2022-080622 (JP), filed on May 17, 2022; and application No. 2023-031514 (JP), filed on Mar. 2, 2023.
Prior Publication US 2023/0375728 A1, Nov. 23, 2023
Int. Cl. G01T 1/24 (2006.01); A61B 6/42 (2024.01)
CPC G01T 1/24 (2013.01) [A61B 6/4208 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A radiation detector comprising:
a semiconductor layer;
a circuit board; and
a heat conduction member,
wherein a first area in which the semiconductor layer and the heat conduction member overlap each other in this order, and the circuit board does not overlap, and a second area in which the semiconductor layer, the circuit board, and the heat conduction member overlap each other in this order are provided adjacent to each other in a case where the radiation detector is seen through from a direction perpendicular to a main surface of the semiconductor layer,
the first area is provided with a space separating the semiconductor layer and the heat conduction member in the direction perpendicular to the main surface at a boundary portion with the second area, and
a height of the space in the direction perpendicular to the main surface of the semiconductor layer is larger than a thickness of the circuit board.